To introduce and discuss various issues related to the system packaging
UNIT I OVERVIEW OF ELECTRONIC SYSTEMS PACKAGING 9
Functions of an Electronic Package, Packaging Hierarchy, IC packaging: MEMS packaging, consumer electronics packaging, medical electronics packaging, Trends, Challenges, Driving Forces on Packaging Technology, Materials for Microelectronic packaging, Packaging Material Properties, Ceramics, Polymers, and Metals in Packaging, Material for high density interconnect substrates
UNIT II ELECTRICAL ISSUES IN PACKAGING 9
Electrical Issues of Systems Packaging, Signal Distribution, Power Distribution, Electromagnetic Interference, Transmission Lines, Clock Distribution, Noise Sources, Digital and RF Issues. Design Process Electrical Design: Interconnect Capacitance, Resistance and Inductance fundamentals; Packaging roadmaps – Hybrid circuits – Resistive, Capacitive and Inductive parasitics
UNIT III CHIP PACKAGES 9
IC Assembly – Purpose, Requirements, Technologies, Wire bonding, Tape Automated Bonding, Flip Chip, Wafer Level Packaging, reliability, wafer level burn – in and test. Single chip packaging: functions, types, materials processes, properties, characteristics, trends. Multi chip packaging: types, design, comparison, trends. System – in – package (SIP); Passives: discrete, integrated, and embedded
UNIT IV PCB, SURFACE MOUNT TECHNOLOGY AND THERMAL CONSIDERATIONS 9
Printed Circuit Board: Anatomy, CAD tools for PCB design, Standard fabrication, Micro via Boards. Board Assembly: Surface Mount Technology, Through Hole Technology, Process Control and Design challenges. Thermal Management, Heat transfer fundamentals, Thermal conductivity and resistance, Conduction, convection and radiation – Cooling requirements
UNIT V TESTING 9
Reliability, Basic concepts, Environmental interactions. Thermal mismatch and fatigue – failures – thermo mechanically induced –electrically induced – chemically induced. Electrical Testing: System level electrical testing, Interconnection tests, Active Circuit Testing, Design for Testability
At the end of the course, the student should be able to:
Give a comprehensive introduction to the various packaging types used along with the associated thermal, speed, signal and integrity power issues
Enable design of packages which can withstand higher temperature, vibrations and shock
Design of PCBs which minimize the EMI and operate at higher frequency
Analyze the concepts of Testing and testing methods
- Tummala, Rao R., Fundamentals of Microsystems Packaging, McGraw Hill, 2001
- Blackwell (Ed), The electronic packaging handbook, CRC Press, 2000.
- Tummala, Rao R, Microelectronics packaging handbook, McGraw Hill, 2008.
- Bosshart, Printed Circuit Boards Design and Technology, TataMcGraw Hill, 1988.
- R.G. Kaduskar and V.B.Baru, Electronic Product design, Wiley India, 2011
- R.S.Khandpur, Printed Circuit Board, Tata McGraw Hill, 2005
- Recent literature in Electronic Packaging
- Michael L. Bushnell &Vishwani D. Agrawal,‖ Essentials of Electronic Testing for Digital, memory & Mixed signal VLSI Circuits‖, Kluwer Academic Publishers.2000.
- M. Abramovici, M. A. Breuer, and A.D. Friedman, ―Digital System Testing and Testable Design‖, Computer Science Press,1990